I. Two methods of CMOS discharge
Method 1: Using a CMOS discharge jumper
The CMOS discharge jumper is typically a three-pin jumper located near the CMOS battery socket on the motherboard, and comes with battery discharge instructions. In the motherboard's default state, the jumper cap is connected to pins labeled "1" and "2," which, according to the discharge instructions, indicates "Normal," meaning normal operating conditions.
To use this jumper to discharge the CMOS, first use tweezers or another tool to remove the jumper cap from pins "1" and "2", then place it on pins "2" and "3" and connect them. The discharge instructions indicate that this will result in the status "Clear CMOS". After a brief contact, all user-defined settings in the BIOS will be cleared, restoring the motherboard to its factory default settings.
jumper cap
After removing the jumper cap, insert pins 2 and 3 and wait a moment. Then remove the jumper cap again and reinsert pins 1 and 2.
After discharging the CMOS, the jumper cap needs to be removed from pins "2" and "3" and then returned to its original position on pins "1" and "2". Note that if the jumper cap is not returned to the Normal state, the computer will fail to boot and an alarm will sound.
Method 2: Remove the CMOS battery
Many users have likely encountered the following situation: They need to discharge the CMOS, but cannot find the CMOS discharge jumper on the motherboard (such as an ASUS motherboard). What can they do? In this case, they can use the CMOS battery to achieve the discharge purpose. Since the BIOS is powered by the CMOS battery, removing the battery will cut off the BIOS power supply, thus clearing the parameters set in the BIOS.
Locate the CMOS battery socket on the motherboard, then press the clip on the socket that holds the power supply battery to one side. The CMOS battery will automatically pop out. Carefully remove the battery.
Next, turn on the computer by connecting the power supply. The screen will then display a message indicating that the data in the BIOS has been cleared and you need to enter the BIOS to reset it. This proves that the CMOS has been successfully discharged.
II. CMOS Image Sensor Module Structure Design
Today's CMOS image conversion technology not only serves "traditional" industrial image processing but is also being adopted by a wider range of novel consumer applications due to its superior performance and flexibility. Furthermore, it ensures high safety and comfort while driving. Initially, CMOS image sensors were used in industrial image processing; they remain a crucial component in new automation solutions aimed at improving productivity, quality, and the economics of production processes.
According to market research firm IMS Research, the European industrial image processing market is projected to grow at an annual rate of 6% in the coming years, with intelligent solutions integrating software functions into cameras expected to expand their market share. In Germany, data from the national machine tool supplier association VDMA shows that the image processing market grew by 14% in 2004. Market research firm In-Stat/MDR also points out that the image sensor sub-market alone will see an annual growth rate exceeding 30%, and this trend will continue until 2008. Most importantly, CMOS sensors will grow seven times faster than CCD sensors, with the rapid proliferation of camera phones and digital cameras being the primary driver of this demand.
Generally speaking, the module used for CMOS image sensors is called CCM (Compact Camera Module), and its packaging structure can be divided into three basic types.
The first type of main structure, known as POF (Package On Flex), as the name suggests, involves bonding the entire packaged image sensor chip CMOS, along with the substrate, onto a flexible substrate, as shown in Figure 3.
Figure 3 CCM Module Structure Design Type - POF
Another type of module is the so-called COF (ChipOnFlex) type main architecture, in which the sensor chip in the structure is directly bonded to a flexible substrate without any supporting base. The chip flexible board consists of a flexible part and a rigid board or copper plate at the bottom of the chip. See Figure 4.
Figure 4. CCM Module Structure Design Type - COF
The last type of module structure is based on a holder, which is similar to the first POF structure. The only difference is that it is a form of module packaging where the holder is completely covered on the chip.
Currently, the module packaging processes of various companies on the market are slightly different, but they are mostly similar. The following figure shows the disassembly structure of the iPhone infrared face recognition module and a general mobile phone module.
Figure 5. Structure of iPhone face recognition sensor module
Figure 6. Structure of a standard variable zoom sensor module
The above is the content related to "CMOS" brought to you by the editor. Through this article, we hope that you will have a certain understanding of CMOS discharge methods and the module design of CMOS image sensors.
