In the entire semiconductor industry chain, processing and manufacturing is one of the most crucial links. Given this enormous market, semiconductor process equipment provides the manufacturing foundation for large-scale semiconductor production. This article will focus on introducing the main equipment used in the semiconductor production process.
1. Single crystal furnace
Equipment function: Melt semiconductor materials, pull single crystals, and provide single crystal semiconductor blanks for subsequent semiconductor device manufacturing.
Major international brands: PVA TePla AG (Germany), Ferrotec (Japan), QUANTUM DESIGN (USA), Gero (Germany), and KAYEX (USA).
Major domestic brands: Beijing Jingyuntong, Sevenstar Huachuang, Beijing Jingyi Century, Hebei Jinglong Sunshine, Xi'an Ligong Jinke, Changzhou Huasheng Tianlong, Shanghai Hanhong, Xi'an Huade, China Electronics Technology Group Corporation No. 48 Research Institute, and Shanghai Shenhe Thermomagnetic.
2. Vapor phase epitaxy furnace
Equipment Function: To provide a specific process environment for vapor phase epitaxy (VPE), enabling the growth of thin-layer crystals on a single crystal substrate that correspond to the crystal phase of the single crystal, thus laying the foundation for the functionalization of single-crystal substrates. Vapor phase epitaxy is a special process of chemical vapor deposition (CVD) in which the crystal structure of the grown thin layer is a continuation of that of the single-crystal substrate, and maintains a corresponding relationship with the crystal orientation of the substrate.
Major international brands include: CVD Equipment (USA), GT (USA), Soitec (France), AS (France), Proto Flex (USA), Kurt J. Lesker (USA), and Applied Materials (USA).
Major domestic brands include: China Electronics Technology Group Corporation No. 48 Research Institute, Qingdao Serida, Hefei Kejing Materials Technology Co., Ltd., Beijing Jinsheng Micro-Nano, and Jinan Liguan Electronic Technology Co., Ltd.
3. Molecular beam epitaxy system
Equipment Function: Molecular beam epitaxy system provides process equipment for growing thin films on a substrate surface according to specific requirements; Molecular beam epitaxy is a technique for preparing single-crystal thin films, which involves growing thin films layer by layer along the crystal axis of the substrate material under appropriate substrate and suitable conditions.
Major international brands: Riber (France), Veeco (USA), DCA Instruments (Finland), SVTAssociates (USA), NBM (USA), Omicron (Germany), MBE-Komponenten (Germany), and Oxford Applied Research (OAR) (UK).
Major domestic brands include: Shenyang Zhongke Instruments, Beijing Huidexin Technology Co., Ltd., Shaoxing Kuangtai Instrument Equipment Co., Ltd., and Shenyang Keyou Vacuum Technology Co., Ltd.
4. Oxidation Furnace (VDF)
Equipment function: To perform oxidation treatment on semiconductor materials, providing the required oxidation atmosphere, and realizing the oxidation process of the semiconductor as intended. It is an indispensable part of the semiconductor processing.
Major international brands: Thermco (UK) and Centrotherm thermal solutions GmbH Co.KG (Germany).
Major domestic brands: Beijing Sevenstar Innovation, Qingdao Furunde, 48th Research Institute of China Electronics Technology Group Corporation, Qingdao Xuguang Instrument Equipment Co., Ltd., and 45th Research Institute of China Electronics Technology Group Corporation.
5. Low-Pressure Chemical Vapor Deposition System (LPCVD)
Equipment function: The vapor of gaseous or liquid reactants containing the elements constituting the thin film, as well as other gases required for the reaction, are introduced into the reaction chamber of the LPCVD equipment, where a chemical reaction occurs on the substrate surface to generate a thin film.
Major international brands: Hitachi, Inc. (Japan)
Major domestic brands: Shanghai Chijian Semiconductor Technology Co., Ltd., the 48th Research Institute of China Electronics Technology Group Corporation, the 45th Research Institute of China Electronics Technology Group Corporation, Beijing Instrument Factory, and Shanghai Machinery Factory.
6. Plasma-enhanced chemical vapor deposition system (PECVD)
Equipment function: In the deposition chamber, glow discharge is used to ionize the substrate and then carry out a chemical reaction to deposit semiconductor thin film materials.
Major international brands: Proto Flex (USA), Tokki (Japan), Shimadzu (Japan), Lam Research (USA), and ASM International (Netherlands).
Major domestic brands: China Electronics Technology Group Corporation No. 45 Research Institute, Beijing Instrument Factory, and Shanghai Machinery Factory.
7. Magnetron Sputtering Stage (MSA)
Equipment function: Through a closed magnetic field parallel to the target surface and an orthogonal electromagnetic field formed on the target surface during diode sputtering, secondary electrons are bound to a specific area on the target surface, achieving high ion density and high energy ionization, and high-rate sputtering deposition of target atoms or molecules onto the substrate to form a thin film.
Major international brands: PVD (USA), Vaportech (USA), AMAT (USA), Hauzer (Netherlands), Teer (UK), Platit (Switzerland), Balzers (Switzerland), and Cemecon (Germany).
Major domestic brands include: Beijing Instrument Factory, Shenyang Zhongke Instrument, Chengdu Nanguang Industrial Co., Ltd., the 48th Research Institute of China Electronics Technology Group Corporation, Kerui Equipment Co., Ltd., and Shanghai Machinery Factory.
8. Chemical Mechanical Polishing (CMP) Machine
Equipment function: It grinds and polishes the workpiece (semiconductor) through the combined action of mechanical grinding and chemical liquid dissolution and "corrosion".
Major international brands: Applied Materials Inc. (USA), Noval Systems Inc. (USA), and Rtec Inc. (USA).
Major domestic brands: Lanzhou Lanxin High-Tech Industry Co., Ltd., and Ailite Microelectronics.
9. Photolithography machine
Equipment function: To apply photoresist to the surface of a semiconductor substrate (silicon wafer), transferring the pattern on the photomask onto the photoresist, and temporarily "copying" the device or circuit structure onto the silicon wafer.
Major international brands: ASML (Netherlands), Lam Research (USA), Nikon (Japan), Canon (Japan), ABM (USA), SUSS (Germany), and MYCRO (USA).
Major domestic brands: China Electronics Technology Group Corporation No. 48 Research Institute, China Electronics Technology Group Corporation No. 45 Research Institute, Shanghai Machinery Plant, Chengdu Nanguang Industrial Co., Ltd.
10. Reactive Ion Etching (RIE) System
Equipment function: High-frequency voltage is applied between the flat electrode to generate an ion layer hundreds of micrometers thick. The sample is placed in the plate, and the ions bombard the sample at high speed to achieve chemical etching and physical impact, thereby realizing the processing and shaping of semiconductors.
Major international brands: Evatech (Japan), NANOMASTER (USA), REC (Singapore), JuSung (Korea), and TES (Korea).
Major domestic brands include: Beijing Instrument Factory, Beijing Sevenstar Electronics Co., Ltd., Chengdu Nanguang Industrial Co., Ltd., and the 48th Research Institute of China Electronics Technology Group Corporation.
11. ICP plasma etching system
Equipment function: One or more gas atoms or molecules are mixed in the reaction chamber and form plasma under the action of external energy (such as radio frequency, microwave, etc.). On the one hand, the active groups in the plasma react chemically with the surface material to be etched to generate volatile products; on the other hand, the ions in the plasma are guided and accelerated under the action of bias voltage to achieve directional and accelerated corrosion of the surface to be etched.
Major international brands: Oxford Instruments (UK), Torr (USA), Gatan (USA), Quorum (UK), Lehman (USA), and Pelco (USA).
Major domestic brands include: Beijing Instrument Factory, Beijing Sevenstar Electronics Co., Ltd., the 48th Research Institute of China Electronics Technology Group Corporation, Godell Plasma Technology (Hong Kong) Holdings Limited, Institute of Microelectronics of Chinese Academy of Sciences, North Microelectronics, Beijing Oriental Zhongke Integrated Technology Co., Ltd., and Beijing Chuangshi Weina Technology.
12. Wet etching and cleaning machine
Equipment Function: Wet etching is a technique that involves immersing the etching material in an etching solution for etching. Cleaning is necessary to reduce contamination, as contamination can affect device performance, lead to reliability issues, and reduce yield. Therefore, thorough cleaning is required before each layer is processed or before the next layer is applied.
Major international brands: Screen (Japan), SEMES (Korea), Tokyo Electron (Japan), and Lam Research (USA).
Major domestic brands: Nantong Hualin Kona Semiconductor Equipment Co., Ltd., Beijing Sevenstar Electronics Co., Ltd., the 45th Research Institute of China Electronics Technology Group Corporation, and Taiwan Hongsu.
13. Ion Implanter (IBI)
Equipment function: To dope the area near the surface of a semiconductor.
Major international brands: Varian Semiconductor Equipment Corporation (USA), CHA Corporation (USA), AMAT Corporation (USA), and Varian Semiconductor Manufacturing Equipment Corporation (acquired by AMAT).
Major domestic brands include: Beijing Instrument Factory, the 48th Research Institute of China Electronics Technology Group Corporation, Chengdu Nanguang Industrial Co., Ltd., Shenyang Fangji Light Industry Machinery Co., Ltd., and Shanghai Sito Microelectronics Co., Ltd.
14. Probe testing station
Equipment function: By having probes contact the pads of semiconductor devices, electrical tests are performed to determine whether the semiconductor's performance indicators meet the design performance requirements.
Major international brands: Ingun (Germany), QA (USA), MicroXact (USA), Ecopia (South Korea), and Leeno (South Korea).
Major domestic brands include: the 45th Research Institute of China Electronics Technology Group Corporation, Beijing Sevenstar Electronics Co., Ltd., Ruike Instruments, Huarong Group, and Shenzhen Senmei Xieer Technology.
15. Wafer thinning machine
Equipment function: To reduce the thickness of wafers through polishing.
Major international brands: DISCO (Japan), G&N (Germany), OKAMOTO (Japan), and Camtek (Israel).
Major domestic brands include: Lanzhou Lanxin High-Tech Industry Co., Ltd., Shenzhen Fangda Grinding Equipment Manufacturing Co., Ltd., Shenzhen Jinshili Precision Grinding Machinery Manufacturing Co., Ltd., Weianda Grinding Equipment Co., Ltd., and Shenzhen Huanianfeng Technology Co., Ltd.
16. Wafer Dicing Machine (DS)
Equipment function: To cut wafers into small dies.
Major international brands: OEG (Germany) and DISCO (Japan).
Major domestic brands include: China Electronics Technology Group Corporation No. 45 Research Institute, Beijing Kechuangyuan Optoelectronic Technology Co., Ltd., Shenyang Instrument and Meter Technology Research Institute, Northwest Machinery Co., Ltd. (formerly State-owned Northwest Machinery Plant Factory 709), Huisheng Electronics & Electromechanical Equipment Co., Ltd., Lanzhou Lanxin High-Tech Industry Co., Ltd., Han's Laser, Shenzhen Ruby Laser Equipment Co., Ltd., Wuhan Sangong, Zhuhai Lailian Optoelectronics, and Zhuhai Yuemao Technology.
17. Wire Bonder
Device function: Connects the pads on the semiconductor chip to the pads on the pins using conductive metal wires (gold wires).
Major international brands: Autotech (USA), TPT (Germany), FK (Austria), and UNISEM (Malaysia).
Major domestic brands: China Electronics Technology Group Corporation No. 45 Research Institute, Beijing Chuangshijie Technology Development Co., Ltd., Yuxin (Chengdu) Integrated Circuit Packaging and Testing Co., Ltd. (invested by Unison Malaysia), Shenzhen Kaijiu Automation Equipment Co., Ltd.
