With the rapid development of electronic smart products, the market demand for semiconductors continues to rise, placing higher demands on semiconductor packaging technology. As one of the processing equipment in the back-end processes of semiconductor chips, the dicing machine is used for precision processing such as dicing, splitting, or slotting of wafers. The quality and speed of its cutting directly affect the quality of the chips and production efficiency.
CDHD2 servo solution assists dicing machine in efficient dicing.
The dicing machine uses high-power grinding as its dicing mechanism and an air-static electric spindle as its actuator. It dices wafers at a speed of 30,000 to 60,000 rpm. At the same time, the worktable carrying the wafer moves in a straight line at a certain speed along the dicing line direction at the contact point between the blade and the wafer, separating each chip with independent electrical components.
(Schematic diagram)
Due to the complexity of the dicing process, customers have placed higher demands on the motion control performance of each axis of the dicing machine. To address this, Gaocheng provides a servo solution—the X-axis uses a CDHD driver + PH2 motor, the Y-axis uses a CDHD driver + PH2 motor, and the rotary axis uses a CDHD driver + DDR motor. This three-axis linkage enables the dicing machine to achieve fast, stable, and precise dicing and cleaning motions.
"Stability" comes first, and the cutting is faster.
The High-Tech CDHD driver employs a brand-new electrical loop design with a frequency response of 3-5 kHz and utilizes an innovative anti-vibration algorithm to effectively eliminate mechanical resonance. The CDHD2 driver, an upgrade from the first-generation CDHD driver, features an adaptive nonlinear control algorithm and incorporates multiple gain parameters to minimize position error and settling time. The CDHD2 driver also employs a dual-loop position and velocity control algorithm to enhance the overall motion system performance.
Applying a servo solution consisting of a high-performance CDHD2 driver and a CDHD driver to a dicing machine enables the machine to quickly cut chips within the dicing channel at a high speed of 2000-2500 rpm.
In cutting and alignment processes, the X-axis can achieve precise positioning at high speeds and complete rapid cutting, thus improving efficiency.
When the X-axis returns at high speed after slicing, it is fast, accurate, stable, and does not overshoot.
The Y-axis operates at high speed and has a short settling time, which helps to improve the efficiency of cutting.
The ROT axis exhibits low following error, short settling time, and minimal pulse fluctuation after stabilization during high-speed operation.
In terms of positioning accuracy, the position compensation function within the CDHD2 driver fully meets customer precision requirements, allowing customers to add up to 1000 compensation points to the stroke. Regarding stability, this solution employs the HD algorithm and automatic tuning to re-optimize gain parameters, enabling the dicing machine to achieve fast and smooth dicing motion without overshoot or jitter upon stopping. This also improves the quality and efficiency of chip processing for customers, avoiding chip material waste.
Under the major trend of chip self-sufficiency, the CDHD2 servo solution can help customers in the semiconductor industry improve chip manufacturing processes. In the future, Gaocheng will continue to follow this trend, continuously launching faster, more accurate, and more stable servo system solutions to accelerate the development of China's semiconductor industry.
