To meet the needs of numerous industries, from medical device manufacturing to electronics manufacturing, it may be necessary to create large, dense areas with highly precise and accurately positioned micro-holes. Smaller diameters make mechanical drilling more difficult due to the risks of damage and drill bit misalignment. Laser drilling overcomes these problems because a precise laser beam is focused to be equal to or smaller than the required hole diameter. Furthermore, it is a non-contact process, thus preventing any damage.
Laser drilling presents numerous challenges, including controlling the tapered shape from inlet to outlet to achieve a high aspect ratio. This depends on focus control as the beam passes through the material surface and becomes more difficult as the surface thickens. Thousands of holes may also need to be drilled to meet smaller diameter requirements, thus necessitating smaller laser spot sizes. Other factors include beam shaping and careful selection of the laser wavelength, as well as ensuring accurate placement and hole precision over large areas using the motion system.
Key features of this motion solution
• High-precision feature shape;
• Increased pore density;
• Precise taper control;
• Consistent, clean, and fast drilling process;
• High processing power;
• Easy to laser integrate.
① Z-axis – Reliable laser height control
• The high-precision ball screw linear platform, equipped with a servo motor and brake, can operate safely and reliably under high loads;
• Absolute encoders can avoid collisions;
• Rugged industrial IP65 connectors for flexible cable outlets;
• Side seals and a hard cap prevent particles from entering.
②Z-axis – Laser focusing enables taper and cross-section control.
• Voice coil direct drive motor enables frictionless operation and high scanning frequency;
• Integrated linear encoder enables accurate position feedback;
• Adjustable gravity compensation ensures safe operation;
• Flexible installation options for easy integration.
③ XY axis – for precision positioning of the workpiece
• XY scanners based on piezoelectric ceramics enable highly dynamic and nanometer-level precision positioning;
• Parallel motion design enables identical dynamics in both the X and Y directions;
• Zero-backlash flexible hinge guidance provides high guiding accuracy;
• Sub-nanometer resolution with long-term stability;
• Fast, millisecond-level settling time;
• Nanoscale high tracking accuracy.
④ XY axis – Positioning the workpiece over long strokes
• High-dynamic coreless linear motors enable rapid and precise contour machining;
• Reference edges can simplify alignment in the machine;
• Purge air connectors, side seals, and hard caps prevent particle ingress;
• Absolute encoders eliminate the need for reference and ensure safety during operation. Flexible and effortless automation control.
• Ether CAT motion control and drive modules provide an open network
connect;
• Generate shapes or trigger predefined drill shapes using EtherCAT;
• Laser pulse control via EtherCAT or analog power output.
Laser control interface: Servo control enables rapid stepping, stabilization, and interference suppression.
ServoBoost™: Enables the addition of fast piezoelectric control to improve the performance of legacy systems.
