1. DIP (Dual In-line Package)
DIP (Dual Inline-pin Package) refers to integrated circuit chips packaged in a dual inline package format. The vast majority of small- and medium-scale integrated circuits (ICs) use this package type, and their pin count generally does not exceed 100. CPU chips using DIP packages have two rows of pins and need to be inserted into a DIP socket. Alternatively, they can be directly soldered onto a circuit board with the same number and arrangement of solder holes. Special care should be taken when inserting or removing DIP-packaged chips from their sockets to avoid damaging the pins.
Features:
1. Suitable for through-hole soldering on PCBs (printed circuit boards), and easy to operate.
2. The ratio between the package area and the chip area is relatively large, so the volume is also relatively large.
The Intel 8088 CPU uses this packaging method, as do cache and early memory chips.
II. Component Encapsulation
PQFP (Plastic Quad Flat Package) chips have very small pin spacing and very thin leads. This packaging method is commonly used for large-scale or very large-scale integrated circuits, typically with over 100 pins. Chips packaged in this way must be soldered to the motherboard using SMD (Surface Mount Device) technology. SMD-mounted chips do not require drilling holes in the motherboard; the motherboard surface usually has pre-designed solder pads for the corresponding pins. By aligning the chip's pins with the corresponding solder pads, soldering is achieved. Chips soldered in this way are difficult to remove without specialized tools.
Chips packaged using the PFP (Plastic Flat Package) method are essentially the same as those packaged using the PQFP method. The only difference is that PQFP is generally square, while PFP can be either square or rectangular.
Features:
1. Applicable to SMD surface mount technology for mounting wiring on PCB circuit boards.
2. Suitable for high-frequency use. 3. Easy to operate and highly reliable.
4. The ratio between chip area and package area is relatively small.
This packaging method is used in Intel CPUs such as the 80286, 80386, and some 486 motherboards.
III. PGA Pin Grid Format
PGA (Pin Grid Array Package) chip packages have multiple square arrays of pins inside and outside the chip, with each array of pins spaced a certain distance around the perimeter of the chip. Depending on the number of pins, they can form 2-5 rings. During installation, the chip is inserted into a dedicated PGA socket. To facilitate easier installation and removal of the CPU, starting with the 486 chip, a CPU socket called ZIF appeared, specifically designed to meet the installation and removal requirements of PGA-packaged CPUs.
ZIF (Zero Insertion Force Socket) refers to a socket with zero insertion and extraction force. By gently lifting the lever on this type of socket, the CPU can be easily and effortlessly inserted. Then, pressing the lever back into place utilizes the special pressure generated by the socket's structure to firmly secure the CPU pins to the socket, eliminating any possibility of poor contact. Removing the CPU chip simply requires gently lifting the lever to release the pressure, allowing the CPU chip to be easily removed.
With the development of the modern information industry, many people are now aware of the importance of chips. The design and manufacturing of a tiny chip often involves complex steps and a lengthy process. Special care must be taken during chip manufacturing, otherwise, it can be scratched or damaged. So, what are the common chip packaging forms? What are the types of chip packaging?
Chips are extremely small, requiring a relatively large casing to mount them on a circuit board. Chip packaging involves placing the bare integrated circuit die, manufactured at the factory, onto a substrate that serves as a support, extending the pins, and finally securing and packaging it into a single unit. This process not only secures and seals the chip but also enhances its electrical and thermal performance and protects it. Therefore, the chip packaging process is crucial and plays a vital role in CPUs and other large-scale integrated circuits.
Currently, the most common chip packaging types on the market are BGA, TSOP, SIP, and SOP. Most high-pin chips now use BGA packaging because it has a relatively large contact area between the solder balls and the substrate, which is beneficial for heat dissipation. Furthermore, the short leads of the solder balls shorten the signal transmission path, thereby reducing lead resistance and inductance, allowing for higher operating frequencies and improved circuit performance. SIP packaging is mainly suitable for multi-functional chips because it can integrate functional chips such as processors and memory into a single package, achieving a basically complete function. This packaging method is mainly used in medical electronics, military electronics, wireless communications, and computer fields.
The SOP (System-on-Package) packaging method has a very typical characteristic: it allows for the creation of numerous pins around the packaged chip, making it more convenient to handle and offering high reliability. It can be considered a true system-on-a-chip (SoC) package. The TSOP (True-on-Package) package type is derived from this, and this type is more suitable for high-frequency applications, offering ease of handling and high reliability.
As the most core component in the electronics industry, chips hold an indispensable position. There are many types of chips, and their packaging varies. Packaging mainly involves integrating the bare die onto a substrate and then bringing out all the pins required by the user to create a powerful whole. This article mainly introduces the packaging types of chips commonly used in the TOT industry.
1. DIP through-hole package
DIP refers to a dual in-line packaged integrated circuit chip. This type of chip packaging has a long history and is used in products such as the 51 microcontroller, AC-DC controllers, and optocoupler operational amplifiers. CPU chips packaged in DIP have two rows of pins and can be used via a dedicated socket. Alternatively, they can be directly inserted into a circuit board with the same number and arrangement of solder holes for soldering. Using a socket allows for easy replacement, and soldering is simple, requiring only a soldering iron for assembly.
2. LQFP/TQFP package
PQFP/TQFP packaged chips have leads on all four sides, with very small spacing between the leads and very thin pins. Chips packaged in this way can be soldered via reflow soldering. The pads are single-sided and do not require vias, making them relatively more difficult to solder than DIP packages. Currently, many microcontrollers and integrated circuits use this type of package. Because of the protruding leads, care must be taken during transportation and soldering to prevent the leads from bending or being damaged.
3. LGA package
Unlike QFN packages, LGA packages have square pads on the bottom and no solder joints on the sides of the chip; all pads are on the bottom. This type of package requires relatively high soldering skills and a high level of chip design expertise. Otherwise, mass production can easily lead to cold solder joints and short circuits. This type of package is commonly used in applications requiring small form factors and advanced technology.
4. BGA (Ball Grid Array) Package
With advancements in integration technology, equipment improvements, and the use of deep submicron technology, LSI, VLSI, and ULSI have emerged, continuously increasing the integration density of silicon single chips. This has led to more stringent requirements for integrated circuit packaging, a dramatic increase in the number of I/O pins, and consequently, increased power consumption. BGA packaging is an electronic component packaging technology that encapsulates electronic components in a multi-layered, spherical structure composed of metal and ceramic to provide better thermal conductivity and a smaller package size. BGA packaging can provide several times more connection points than conventional through-hole packages, thus offering higher signal integrity and lower resistance. BGA packaging also provides higher power density and lower electromagnetic interference (EMI).
5. QFN package type
QFN is a leadless quad flat package, a lead-free package featuring peripheral termination pads and a chip pad for mechanical and thermal integrity exposure. A large ground plane is typically designed on the bottom of the chip; for power ICs, this plane effectively addresses heat dissipation, allowing heat to be conducted away more quickly through the PCB's copper trace. This package can be square or rectangular. Electrode contacts are located on all four sides. Due to the absence of leads, it occupies less mounting area and has a lower height than QFP, making it a popular package type currently.
6. SO type encapsulation
SO-type packages come in many varieties, including: SOP (Small Outline Package), TOSP (Thin Small Outline Package), SSOP (Shrink SOP), VSOP (Very Small Outline Package), and SOIC (Small Outline Integrated Circuit Package), which are similar to QFP packages. These are chip packages with pins only on both sides. This type of package is a surface-mount package, with pins extending from both sides of the package in an "L" shape. A typical characteristic of this type of package is the presence of many pins around the chip. It offers convenient packaging, high reliability, and easy soldering. Common examples include the SOP-8 package, which is widely used in various types of chips.
