STMicroelectronics, the world’s largest supplier of MEMS sensors for consumer electronics and portable devices, has released a new patented technology that integrates a stand-alone pressure sensor unit in a fully die-molded package to meet the creative design needs of ultra-small sizes and next-generation portable consumer electronics products.
This proprietary technology integrates a stand-alone pressure sensor unit within a fully press-molded package, achieving a fully hermetically sealed wire bond with zero corrosion risk. This avoids damage to the wire bond points during chip assembly by handling devices, eliminates the risk of capacitor separation or damage during packaging, and does not affect the sensor during soldering, ensuring a more durable packaging solution.
This technology represents a revolutionary advancement in the performance and quality of pressure sensors. STMicroelectronics pioneered the use of silicone-free, fully molded packaging in mass-produced accelerometers and gyroscopes, becoming the first MEMS manufacturer to mass-produce higher-precision, high-performance pressure sensors using silicone-free, fully molded packaging technology. Now, it is leveraging this technology to lead a packaging revolution in the emerging field of pressure sensors.
The new technology improves the measurement accuracy of the pressure sensor (±0.2 mbar) while continuing to offer zero drift, low noise (0.010 mbar RMS) and a simplified calibration system, making it particularly suitable for a wide range of consumer electronics, automotive and industrial applications, including indoor and outdoor navigation, location services, enhanced GPS dead reckoning, altimeters and barometers, weather forecasting equipment and medical and fitness equipment.
