Power conversion is often a challenging aspect of any product design. Using standard converter modules in cutting-edge IoT devices or handheld medical devices can be space-constrained, while discrete designs can be both expensive and impractical. To help designers bring products to market faster, RECOM has introduced innovative 3DPP technology, providing a space-saving, high-performance, one-stop power conversion solution.
What is 3DPP?
3DPP stands for 3D Power Packaging®, a cutting-edge surface-mount DC/DC converter technology that offers best-in-class performance without taking up expensive PCB space. RECOM's latest assembly process achieves maximum power density and a significantly smaller package size than other power conversion modules. For example, our RPMB-3.0 series is a 36V 3A SMD power module in a 12.2x12.2x3.75mm shielded housing, achieving incredible power density and up to 94% efficiency without any additional components. In addition to its compact size, 3DPP products can also utilize modern reflow soldering components, reducing supply chain and manufacturing complexity compared to more traditional through-hole power supplies.
How does 3DPP differ from other power converter modules?
3DPP technology reduces the space required for components within a module by mounting internal components directly onto the leadframe, eliminating the need for an internal PCB. For example, one of the newly launched 3DPP switching regulators, the RPX-1.0, measures only 3mm x 5mm x 1.6mm, almost as small as an IC. This size reduction allows engineers and designers to use more streamlined integrated power conversion PCBs without pursuing expensive custom conversion designs. 3DPP technology also enables devices to be packaged in various types, including LGA, gull-wing, QFN, copper pillar bumps, and solder balls, significantly changing the landscape for space-constrained applications.
While size reduction is invaluable for 3DPP products, there are other advantages compared to standard packaged modules that make 3DPP products even more attractive. The compact form factor of 3DPP helps reduce system thermal load, reducing the need for additional thermal management systems and ultimately shortening design time. 3DPP technology eliminates bonding wires on the converter IC, placing the IC directly on the leadframe, significantly reducing thermal resistance. This approach greatly reduces the trace length and footprint of the PCB power loop, while still meeting EMC requirements while allowing for higher switching frequencies.
While some applications may require external passive components, most filtering is done internally in the 3DPP product, sometimes even with an integrated inductor. Another benefit of the compact design is the tight switching current loop, which inherently reduces EMI, making these products highly valuable in EMC-critical environments.
Where can 3DPP technology be used?
3DPP is suitable for any application requiring minimal converter size, high switching frequency, or reduced EMI. Industries such as medical, mobile, energy, IoT, communications/5G, and automotive have embraced 3DPP technology due to its excellent performance and extremely small package size. For example, RECOM's RxxCTxxS series is a medical-grade DC/DC converter ideal for applications requiring high isolation, such as communications, current sensing, and medical applications. Like many other RECOM products, we also offer evaluation boards for device validation and prototyping. If you are interested in learning more about our 3DPP products, or ordering RECOM evaluation boards for prototyping, practical testing, and experiencing the latest 3D Power Packaging® technologies, please contact [email protected]
