Sino-Science Fusion 3D Camera
Zhongke Fusion's self-developed 3D camera observes and understands scenes in three dimensions, transforming the physical 3D world into a digital 3D world. Customizable to meet application needs, the camera utilizes MEMS dynamic structured light and includes an IR camera, an RGB camera, a MEMS chip, and a high-efficiency computing chip. It can complete 3D reconstruction without a host computer, quickly and accurately outputting sub-millimeter precision depth maps and point cloud maps. It also possesses edge computing capabilities for depth training, directly outputting application results. It can be used to collect object depth data, empowering intelligent manufacturing, logistics sorting, robot guidance, assisted medical care, assisted positioning, smart transportation, biometrics, and other scenarios.
AI-3D SoC chip
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MEMS chips
Zhongke Fusion specializes in high-precision and low-cost 3D vision chip technology and is China's first vertically integrated developer and manufacturer of 3D intelligent cameras. It possesses a complete technology reserve and continuous development capability across the entire chain, including basic MEMS chip processes, closed-loop drives, optoelectronic module integration, 3D reconstruction and multi-point cloud fusion algorithms, deep learning algorithms and dedicated SOC integrated circuit acceleration, as well as opto-mechatronic integration of hardware products. Its expertise spans numerous disciplines such as materials science, microelectronics manufacturing, integrated circuit design, deep learning, ensemble imaging, and robotics. It has achieved complete domestic production of high-precision 3D vision chips, from underlying processes and devices to top-level algorithms and applications, solving the "bottleneck" technology problem. It has broken through the "technical bottleneck" of existing 3D imaging chip technology, which cannot achieve high precision and high speed. Notably, its complete set of MEMS micromirror chip technology and drive system, as a new generation of micro-projection technology, along with the Institute of Nano-Tech and Nano-Bionics' third-generation semiconductor substrate and new-generation laser, jointly won the "Chinese Academy of Sciences Major Breakthrough Project" Excellence Award.
The main technological advantages of Sino-Science Fusion are:
• Longer range and higher precision: Zhongke Fusion's MEMS structured light chip is a dynamic structured light stripe projection, which is more than 10 times more accurate than static structured light. It can achieve an accuracy of 0.3mm at a distance of 2-3 meters, and the maximum coverage distance can reach about 5 meters.
• Low cost and low power consumption: Compared to TI's DLP, the price is about 1/3, the size can be controlled to about 1/10, and the power consumption is reduced to the milliwatt level, "it can run as long as you plug in a power bank".
• 3D Modeling and Edge AI Processing in One: The AI-3D intelligent sensing SoC chip is an integrated computing engine that combines AI processing and 3D modeling. Zhongke Ronghe's AI-3D chip is directly applied to terminal 3D application scenarios, achieving a closed-loop product for high-value 3D data acquisition and 3D data analysis through integration with MEMS chips.
Zhongke Fusion Optical Engine and 3D Smart Camera Module
The Sino-US trade friction and the impact of the COVID-19 pandemic have placed immense pressure on China's chip industry. Chinese chip companies need to innovate independently to overcome bottlenecks. There are no shortcuts in chip technology; development and iteration require tape-out cycles, which present both challenges and extremely high barriers to entry. Zhongke Fusion has made relatively rapid progress in the manufacturing and intelligent processing of high-precision 3D vision chips, demonstrating a clear advantage, but it will still seek potential international cooperation. Zhongke Fusion hopes to seize breakthrough opportunities and leverage the advantages of its independently developed domestic chip technology for mass production and low cost to become a "world champion" within a few years. Zhongke Fusion is currently the only domestic technology company possessing both high-precision and low-cost integrated 3D vision chip technology. It has replaced Texas Instruments' DLP chip technology with its self-developed MEMS micromirror chip and replaced the US general-purpose GPU chip used for 3D computing with its self-developed SoC AI-3D dual-engine chip. The price is reduced to one-third compared to foreign solutions, while power consumption and size are reduced by one-tenth. Simultaneously, Zhongke Fusion has integrated a complete 3D camera module with infrared light sources, IR, and RGB cameras. It can achieve high-precision 3D point cloud modeling and raw data output, 3D recognition, 3D modification, and support mainstream deep learning algorithm models, providing a full-chain AI-3D service.
