I. What is MEMS?
MEMS is short for Micro-Electro-Mechanical Systems. These devices are in the millimeter or even micrometer range and have a wide range of applications, including 5G communications, security monitoring, industrial automation, automotive electronics, and consumer electronics. Almost all electronic products on the market today use MEMS devices.
The main advantages of MEMS devices are their small size, light weight, ease of integration, low power consumption, high reliability and sensitivity, and their rapid mass production and application based on traditional IC manufacturing processes.
Microelectromechanical systems (MEMS) typically have internal structures at the micrometer or even nanometer scale, and are independent intelligent systems.
Microelectromechanical systems (MEMS) are high-tech electromechanical devices developed on the basis of microelectronics technology (semiconductor manufacturing technology) and integrating technologies such as photolithography, etching, thin film, LIGA, silicon micromachining, non-silicon micromachining and precision machining.
Microelectromechanical systems (MEMS) are miniature devices or systems that integrate microsensors, microactuators, micromechanical structures, micropower supplies, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communication. MEMS is a revolutionary new technology widely used in high-tech industries and is a key technology related to national scientific and technological development, economic prosperity, and national defense security.
MEMS focuses on ultra-precision machining and involves many disciplines such as microelectronics, materials, mechanics, chemistry, and mechanical engineering. Its scope covers various branches of physics, chemistry, and mechanics, including force, electricity, optics, magnetism, acoustics, and surface science, at the microscale.
Common products include MEMS accelerometers, MEMS microphones, micromotors, micropumps, microoscillators, MEMS optical sensors, MEMS pressure sensors, MEMS gyroscopes, MEMS humidity sensors, MEMS gas sensors, and their integrated products.
However, MEMS packaging is not a universal packaging form. Different structures and MEMS devices have different packaging designs and forms, and are highly specialized. Depending on the application, there will be a variety of different component structures and packaging methods.
Currently, chip-level assembly technology is more commonly used, which imposes strict requirements on assembly accuracy, operating environment, alignment method, and picking force.
II. Challenges in MEMS Chip-Level Assembly
1. High packaging precision requirements
MEMS systems contain special signal interfaces, housings, cavities, and other structures, which increases the difficulty of position and angle control during the bonding process of MEMS devices and functional substrates.
2. The material is fragile and easily broken.
MEMS devices, such as micro accelerometers, micro motors, and micro gyroscopes, typically contain mechanical parts such as cavities or cantilever arms. Due to their tiny size, these structures have much lower mechanical strength than IC chips, making them easily damaged by physical contact and exposure during post-processing such as dicing and assembly.
Many components in MEMS devices are not only tiny in size but also made of fragile and brittle materials, such as deep trenches, micromirrors, and fan blades. Therefore, the pressure used during bonding is crucial. Insufficient pressure results in a weak connection, while excessive pressure damages the device.
It is evident that precise positioning accuracy and bonding strength are essential conditions for improving the yield of MEMS chip-level assembly.
When the component thickness is between 50-150μm, the preferred bonding pressure is between 50 and 100g, and the rotational misalignment should be less than 0.3°. This will minimize damage to the device and improve the bonding yield.
High-precision alignment and placement ensure high yield.
Micrometer-level position feedback enables precise data acquisition, with a force control accuracy of ±0.01N, a linear repeatability accuracy of ±2μm, a rotational repeatability accuracy of ±0.01°, a radial runout of less than 10μm, and a standard encoder resolution of 1μm. It can still output stably at high speeds, improving yield and reliability.
Vacuum suction, controllable pressure, reduces losses
The Guoao linear rotary motor features a hollow Z-axis design with a pre-installed air pipe interface, enabling vacuum suction and plug-and-play operation. Customization services are also available based on component structure and characteristics.
With a "soft landing" function, it can achieve stable force control within ±1.5g and supports programmed settings for speed, acceleration and force control, enabling the placement head to touch MEMS components with very precise pressure and reduce wear.
The integrated Z+R axis design improves speed.
The innovative dual-axis integrated solution combines the traditional "servo motor + ball screw" into one, solving the problem of Z-axis self-weight load. It can complete component pick and place and other actions at high speed and with high precision. The thrust curve is smooth, with a peak thrust of 8-50N, an effective stroke of 10-50mm, and an ultra-long cycle life, achieving high-efficiency production.
