Market Application Background
The localization of core semiconductor equipment is crucial for solving "bottleneck" technologies and safeguarding national strategic security. Driven by policy and downstream demand, the demand for domestically produced equipment has surged. Semiconductor die bonders are core packaging equipment, and their motion control equipment determines the performance of high-speed, high-precision wafer chip placement, which is essential for achieving key steps such as positioning, alignment, and bonding.
This article mainly introduces the application of the XPCIE1032H ultra-high-speed real-time motion control card in high-speed semiconductor die bonders, providing a quick understanding of the use of the XPCIE1032H ultra-high-speed real-time motion control card for positive motion technology.
Traditional control system solutions
Traditional Solution 1 (PLC-based):
The system employs a combination of PLC, touchscreen, industrial computer, and machine vision. Its drawbacks include the need to switch between the PLC and PC screens for motion control and machine vision debugging, resulting in cumbersome operation. Furthermore, the PLC's slow response time due to scanning cycle limitations and low data exchange rate with the PC contribute to the overall low productivity of the equipment.
Traditional Solution 2 (based on a motion control card):
It adopts a PCI motion control card + industrial computer + machine vision. The motion control card is integrated into the industrial computer and communicates with the vision through a high-speed PCI interface. It has fast data interaction, simple single-screen debugging, and significantly improves the speed and accuracy of die picking and bonding, ultimately achieving higher UPH capacity.
Positive motion technology solutions
The positive motion technology solution is based on an industrial computer, an XPCIE1032 ultra-high-speed motion control card, and machine vision, which improves productivity and stability.
Utilizing Windows real-time kernel technology, motion control, I/O, and other processing are executed within the CPU core. Command issuance and retrieval with PC machine vision are achieved through CPU memory interaction, resulting in an interaction speed that is tens of times faster than traditional PCI/PCIe motion control cards and 50-100 times faster than PLC network port data interaction. Compared to traditional motion control cards or PLC solutions, the overall efficiency is improved by 6%-20%+.
01. Application of the ultra-high-speed real-time motion control card XPCIE1032H in high-speed semiconductor die bonders
Positive Motion High-Speed Semiconductor Die Bonder Solution Architecture
1. 16DI: Connects to origin and limit photoelectric sensors, sensors, switch inputs, and other signals;
2. 16DO: Connects to solenoid valves for signal acquisition, vacuum breaking, and visual imaging; connects two cameras;
3. EtherCAT interface: 125us EtherCAT synchronization cycle, connecting die bond swing arm axis, die bond loading and unloading axis, blue film ejector pin axis, silver paste dispensing axis, carrier substrate feeding axis and other 12 servo and stepper axes; also expands EtherCAT IO module.
Die bonding machine process operating principle
The die bonder consists of a material handling unit, a material feeding unit, a dispensing unit, a swing arm, a die bonding platform, a blue film ejector platform, fixtures, and a material unloading mechanism. It integrates opto-electro-mechanical technologies such as high-speed precision positioning, visual positioning, and pneumatic suction. The core control steps are as follows:
01. Visual positioning:
Identify the position of the wafer chip and the carrier substrate
02. Dispensing adhesive:
Precisely apply silver paste to designated locations on the carrier substrate.
03. Mounting:
The swing arm picks up the wafer chip and precisely places it at the dispensing position.
MotionRT750 real-time motion control kernel, dedicated x86 CPU kernel
The XPCIE1032 ultra-high-speed motion control card is equipped with the Windows real-time kernel MotionRT750 and adopts a dual-system architecture of Windows non-real-time layer + MotionRT750 real-time layer. The real-time layer ensures that motion control is not affected by Windows fluctuations/jitter, guaranteeing high precision and stability; the non-real-time layer seamlessly integrates with a wide range of Windows applications such as VS/CAD/CAM, greatly improving development and debugging efficiency.
Command interaction cycles as fast as microseconds
The XPCIE1032 ultra-high-speed motion control card is equipped with the Windows motion control real-time kernel MotionRT750, which directly utilizes the CPU/memory of the PC for calculation, greatly improving function execution efficiency and response speed, thereby significantly increasing the UPH (Upload, Power, and Hatch) capacity of the die bonder.
Through practical testing using languages such as C# and C++, the results show that its communication speed far exceeds that of traditional PCI/PCIE card solutions and PLC network port interaction solutions, resulting in a significant improvement in overall production capacity.
Under the same testing environment, after 50 linear motor reciprocating motions and 1000 IO flip tests, the control cycle of the MotionRT750 solution is shortened by about 2500ms compared to traditional PCI communication, and the efficiency is improved by more than 17.1%.
Motion control cycle as fast as 50µs
The XPCIE1032 ultra-high-speed real-time motion control card is equipped with the Windows real-time kernel MotionRT750. When performing 16-axis or 32-axis EtherCAT bus control, its EtherCAT communication synchronization cycle can be shortened to 125μs, and the motion control cycle can be as fast as 50μs, significantly improving EtherCAT communication efficiency.
In precision motion control applications such as die bonding, it enables faster and smoother motion trajectory planning. Compared to traditional pulse control cards, its wiring is simpler and maintenance is more convenient.
More stable, safer, and more reliable
Industrial automation equipment must meet the requirement of continuous operation 24/7; any abnormal downtime will cause significant losses. The XPCIE1032 ultra-high-speed motion control card is equipped with the Windows motion control real-time kernel MotionRT750. Through EtherCAT bus redundancy and PC fault isolation technology, it builds a highly reliable control system, unaffected by Windows blue screen errors, providing stable and secure protection for industrial production.
EtherCAT bus redundancy technology:
Automatic switching in case of communication link failure significantly reduces the risk of downtime caused by disconnection, and 32 axes can operate stably for as little as 125µs.
PC-level fault hard isolation:
Unaffected by Windows blue screen errors, the MotionRT750 real-time kernel continues to run independently even when the Windows system experiences a blue screen or crash, and the emergency stop button remains functional, ensuring the safety of the production process.
Flowchart of High-Speed Semiconductor Die Bonding Machine Process
Summary of the advantages of the solution
1. Unified API, flexible development: Supports development in multiple host computer languages, and all product series can call the same set of API functions, making user development more flexible.
2. Break through the real-time bottleneck and achieve stable and efficient operation: Completely solve the problem of non-real-time control of traditional PCI/PCIE cards in the Windows environment, ensuring efficient and stable operation of the equipment.
3. Lightning-fast response, significantly improved productivity: Based on in-core interaction technology, instruction response reaches the microsecond level, which is tens of times faster than traditional PCI/PCIE solutions. Actual measurements show UPH increased to 22K per head and 43K per dual head, resulting in an overall production efficiency improvement of over 10%.
4. Multi-channel aerial photography, shortening the cycle: Equipped with 16 independent hardware position comparison outputs, it supports simultaneous execution of multi-station visual aerial photography, effectively shortening the machine CT cycle.
5. Intelligent motion control for smooth and precise movements: Integrating SS curve acceleration and deceleration, arched running and online speed change functions to achieve "soft landing" and ensure smoother, gentler and more precise crystal picking/soldering operations.
Hardware selection and configuration
02. XPCIE1032H Motion Control Card Product Introduction
1. 6-64 axis EtherCAT bus + pulse selectable, including 4 single-ended 500KHz pulse outputs for easy connection to pulse drive;
2. 32-axis EtherCAT synchronization cycle of 125µs, supports multi-card linkage;
3. Onboard 16 general-purpose inputs and 16 general-purpose outputs, including 8 high-speed inputs and 16 high-speed outputs;
4. Supports PWM output, precision output, PSO hardware position comparison output, visual capture, etc.
5. Supports linear interpolation, circular interpolation, continuous trajectory machining (speed look-ahead), and high-order SS curve acceleration/deceleration;
6. Supports functions such as electronic cam, electronic gear, position latching, synchronous following, virtual axis, and pitch compensation;
7. Supports forward and inverse kinematics algorithms for 30+ robotic arm models, such as SCARA, Delta, UVW, 4-axis/5-axis RTCP...
To help you better and faster develop and apply high-speed semiconductor die bonder solutions based on the XPCIE1032H ultra-high-speed real-time motion control card, we have prepared detailed documentation. For further information on usage, parameter configuration, and practical application examples, please contact us at 400-089-8936.
