Electronics

Engineering Practices on Power Module Encapsulation Process and Heat Dissipation Performance Improvement

I. Heat dissipation mechanism and material selection in potting process 1. Optimization of heat conduction paths Encaps...

Articles
2026-02-23

The allure of machine vision in the field of automation

Abstract: Machine vision inspection technology possesses unparalleled technical advantages over other inspection scheme...

Articles
2026-02-22

Advanced Packaging Technology for Three-Level IGBT Modules

Foreword By using three or more power modules, each individually packaged with a series of 650V IGBT chips in series, t...

Articles
2026-02-22

IGBT modules using thin, low-inductance packages

1. Introduction For 20 years, the 94*34mm packaged IGBT module has become the industry standard. Since then, major comp...

Articles
2026-02-22