Abstract: This paper introduces the application of linear motors in dicing machines. Results show that linear motors exhibit excellent performance in high-precision positioning and feeding. Keywords : linear motor, dicing machine, high accuracy of positioning With the rapid development of industries such as computers, communications, and high-performance consumer electronics, the demand for ICs is increasing. It is estimated that China's demand for ICs will exceed 18 billion units in 2008, while the current packaging volume of various ICs in China is only 3.8 billion units, indicating that domestic packaging production cannot meet domestic market demand. In the post-packaging process of integrated circuits, semiconductor chip dicing is the first step. Due to the high precision requirements, linear motors were selected for high-precision positioning and feeding mechanisms in our self-developed and manufactured dicing machine. Process Flow and Requirements Diceing is the first step in IC post-packaging, and its processing quality directly affects the overall quality of the entire production line. Dicing employs precision cutting technology, typically using diamond grinding wheels with a thickness of 15–50 μm, to separate the individual components on the wafer. The width of the dicing grooves is usually less than 6 μm, and the dicing depth is within 600–1 μm. The dicing machine uses a CCD camera and image processing software to precisely align the wafer. Linear motor stepping resolution reaches up to 1 μm to ensure the accuracy of alignment and processing, achieving the purpose of precision cutting. The IC post-packaging process flow is shown in Figure 1. [b][align=center]For more details, please click: Application of Linear Motors in Dicing Machines[/align][/b]